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Applications
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2003-02-05 |
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D12 Single Fiber Bond Wire Break Detection
To monitor the presence or absence of a bond wire, a high-powered sensor is required. The D12SN6FPH, in conjunction with a PBCT26U, has the optical gain necessary to sense a bond wire as small as 80 microns in diameter. This application requires the position of the bond wire to remain controlled, with minimum flutter, in front of the fiber optic sensing tip.
Objective:
To monitor the presence or absence of bond wire
Sensor Models:
D12SN6FPH
Fiber Optic Models:
PBCT26U
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D12 Wafer Cassette Presence Detection in Vacuum
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2003-02-05
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1271
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210 |
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D12 Small Parts Counting
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728
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209 |
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D12 Single Fiber Bond Wire Break Detection
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838
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208 |
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D12 Robotic Wafer Center Detection
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2003-02-05
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1005
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207 |
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D12 Integrated Circuit Detection
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2003-02-05
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726
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206 |
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D12 Dual Fibers Bond Wire Break Detection
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2003-02-04
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683
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205 |
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D12 Expert Lead Frame Hole Detection
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2003-02-04
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666
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204 |
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D10 Expert and VS2 Stack Height and Adhesive Bead Detection
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719
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203 |
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D10 Expert Poly Bag Seal Detection
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713
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D10 Expert Lead Frame Presence Detection
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922
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11
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