|
Applications
¼¾¼ÀÀ¿ë»ç·Ê
|
|
¤ýÀÛ¼ºÀÏ |
2003-02-04 |
¤ý÷ºÎ#2 |
1044319910.gif
(0KB) (Down:3)
|
¤ýÀÀ¿ëºÐ¾ß | Àü±âÀüÀÚ, ±â°è, ÈÇÐ |
|
¤ýÃßõ: 0 ¤ýÁ¶È¸: 1421
|
|
|
D10 Expert CD Stack Height Verification
A CD duplication process "burns" 25 CDs per cycle. The two discrete outputs of the D10 sensor are programmed to output for half-stack and full-stack conditions (i.e.-Output #1 energizes at 50% and Output #2 energizes at 100% light blockage). When a half-stack (of 25 CDs) is sensed, the duplication machine is re-loaded and cycled. When a full stack of 50 CDs is sensed, the CDs are removed and packaged, and the process cycle restarts.
Objective:
Detect the height of a CD stack at two levels
Sensor Models:
Model D10DNFP
Fiber Optic Models:
Pair of model PDIT26TP two-channel individual fibers (the pair establishes two opposed mode beams).
ÀÚ·áÃâó : BANNER
|
¹øÈ£ |
|
±Û Á¦ ¸ñ |
ÀÀ¿ëºÐ¾ß |
ÀÛ¼ºÀÏ |
Á¶È¸ |
211 |
|
D12 Wafer Cassette Presence Detection in Vacuum
|
Àü±âÀüÀÚ, ±â°è, ÈÇÐ
|
2003-02-05
|
1271
|
|
210 |
|
D12 Small Parts Counting
|
Àü±âÀüÀÚ, ±â°è, ÈÇÐ
|
2003-02-05
|
728
|
|
209 |
|
D12 Single Fiber Bond Wire Break Detection
|
Àü±âÀüÀÚ, ±â°è, ÈÇÐ
|
2003-02-05
|
836
|
|
208 |
|
D12 Robotic Wafer Center Detection
|
Àü±âÀüÀÚ, ±â°è, ÈÇÐ
|
2003-02-05
|
1005
|
|
207 |
|
D12 Integrated Circuit Detection
|
Àü±âÀüÀÚ, ±â°è, ÈÇÐ
|
2003-02-05
|
726
|
|
206 |
|
D12 Dual Fibers Bond Wire Break Detection
|
Àü±âÀüÀÚ, ±â°è, ÈÇÐ
|
2003-02-04
|
682
|
|
205 |
|
D12 Expert Lead Frame Hole Detection
|
Àü±âÀüÀÚ, ±â°è, ÈÇÐ
|
2003-02-04
|
666
|
|
204 |
|
D10 Expert and VS2 Stack Height and Adhesive Bead Detection
|
Àü±âÀüÀÚ, ±â°è, ÈÇÐ
|
2003-02-04
|
719
|
|
203 |
|
D10 Expert Poly Bag Seal Detection
|
Àü±âÀüÀÚ, ±â°è, ÈÇÐ
|
2003-02-04
|
713
|
|
202 |
|
D10 Expert Lead Frame Presence Detection
|
Àü±âÀüÀÚ, ±â°è, ÈÇÐ
|
2003-02-04
|
922
|
|
201 |
|
D10 Expert CD Stack Height Verification
|
Àü±âÀüÀÚ, ±â°è, ÈÇÐ
|
2003-02-04
|
1421
|
|
11
|
|