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| ㆍ작성일 |
2003-02-13 |
| ㆍ첨부#2 |
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| ㆍ응용분야 | 전기전자, 기계, 화학 |
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ㆍ추천: 0 ㆍ조회: 1438  
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VS1 Lead Frame Edge Sensing
In the process of die bonding and wire bonding, lead frames are conveyed in a tall vertical cassette. To increase throughput, the cassettes are inspected to determine if a lead frame is present in each slot.The lead frame can be as thin as 0.1 mm (0.004")and difficult to sense. The VS1 convergent sensor can easily sense this thin profile, as well as non-reflective plastic ball grid arrays (PBGA).
Objective:
To sense the presence of the lead frame in a cassette
Sensor Models:
VS1AN5C10
자료출처 : BANNER
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| 번호 |
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글 제 목 |
응용분야 |
작성일 |
조회 |
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266 |
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 VS1 Lead Frame Edge Sensing
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전기전자, 기계, 화학
|
2003-02-13
|
1438
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265 |
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VS1 Glass Panel Detection
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전기전자, 기계, 화학
|
2003-02-13
|
776
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264 |
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VS1 Conveyor Handling Inspection
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전기전자, 기계, 화학
|
2003-02-13
|
793
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263 |
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VS1 Circuit Board Sensing
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전기전자, 기계, 화학
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2003-02-13
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775
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262 |
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VS1 Bottle Sensing
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전기전자, 기계, 화학
|
2003-02-13
|
703
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261 |
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T8 Missing Candy Detection
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전기전자, 기계, 화학
|
2003-02-13
|
761
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|
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260 |
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T30U Overhead Crane Guidance
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전기전자, 기계, 화학
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2003-02-13
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799
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259 |
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T30U Inverted Object Detection
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전기전자, 기계, 화학
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2003-02-13
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733
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|
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258 |
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T18U Empty Comb Verification
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전기전자, 기계, 화학
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2003-02-13
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709
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257 |
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T18U Clear Material Detection
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전기전자, 기계, 화학
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2003-02-13
|
710
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|
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256 |
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S18 Box Detection
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전기전자, 기계, 화학
|
2003-02-13
|
760
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|
11
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