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¤ýÀÛ¼ºÀÏ 2003-02-04
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D10 Expert and VS2 Stack Height and Adhesive Bead Detection

The D10 Expert sensor, with the fiber optic sensing tip positioned near the adhesive application location, verifies that adhesive is applied to the IC wafers. Opposed pairs of VS2 sensors detect when the levels of filled wafer trays exceed a predetermined height.


Objective:
To verify that adhesive is being applied properly to trays of IP chips and to monitor the stack heights of completed trays of product

Sensor Models:
D10DNFP, VS25EV emitter and VS2RN5R receiver.

Fiber Optic Models:
PBCT26U

ÀÚ·áÃâó : BANNER

  0
3500
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211
D12 Wafer Cassette Presence Detection in Vacuum Àü±âÀüÀÚ, ±â°è, È­ÇÐ 2003-02-05 1276
210
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209
D12 Single Fiber Bond Wire Break Detection Àü±âÀüÀÚ, ±â°è, È­ÇÐ 2003-02-05 843
208
D12 Robotic Wafer Center Detection Àü±âÀüÀÚ, ±â°è, È­ÇÐ 2003-02-05 1009
207
D12 Integrated Circuit Detection Àü±âÀüÀÚ, ±â°è, È­ÇÐ 2003-02-05 730
206
D12 Dual Fibers Bond Wire Break Detection Àü±âÀüÀÚ, ±â°è, È­ÇÐ 2003-02-04 687
205
D12 Expert Lead Frame Hole Detection Àü±âÀüÀÚ, ±â°è, È­ÇÐ 2003-02-04 669
204
D10 Expert and VS2 Stack Height and Adhesive Bead Detection Àü±âÀüÀÚ, ±â°è, È­ÇÐ 2003-02-04 721
203
D10 Expert Poly Bag Seal Detection Àü±âÀüÀÚ, ±â°è, È­ÇÐ 2003-02-04 715
202
D10 Expert Lead Frame Presence Detection Àü±âÀüÀÚ, ±â°è, È­ÇÐ 2003-02-04 926
201
D10 Expert CD Stack Height Verification Àü±âÀüÀÚ, ±â°è, È­ÇÐ 2003-02-04 1424
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