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Applications
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2003-02-04 |
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D10 Expert and VS2 Stack Height and Adhesive Bead Detection
The D10 Expert sensor, with the fiber optic sensing tip positioned near the adhesive application location, verifies that adhesive is applied to the IC wafers. Opposed pairs of VS2 sensors detect when the levels of filled wafer trays exceed a predetermined height.
Objective:
To verify that adhesive is being applied properly to trays of IP chips and to monitor the stack heights of completed trays of product
Sensor Models:
D10DNFP, VS25EV emitter and VS2RN5R receiver.
Fiber Optic Models:
PBCT26U
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D12 Wafer Cassette Presence Detection in Vacuum
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2003-02-05
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1276
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210 |
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D12 Small Parts Counting
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2003-02-05
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731
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209 |
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D12 Single Fiber Bond Wire Break Detection
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2003-02-05
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843
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208 |
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D12 Robotic Wafer Center Detection
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2003-02-05
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1009
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207 |
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D12 Integrated Circuit Detection
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2003-02-05
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730
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206 |
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D12 Dual Fibers Bond Wire Break Detection
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2003-02-04
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687
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205 |
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D12 Expert Lead Frame Hole Detection
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2003-02-04
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669
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204 |
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D10 Expert and VS2 Stack Height and Adhesive Bead Detection
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2003-02-04
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721
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203 |
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D10 Expert Poly Bag Seal Detection
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2003-02-04
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715
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202 |
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D10 Expert Lead Frame Presence Detection
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2003-02-04
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926
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201 |
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D10 Expert CD Stack Height Verification
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2003-02-04
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1424
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11
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