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Applications
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2003-02-04 |
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D10 Expert Lead Frame Presence Detection
An integrated circuit lead frame moves in a U-shaped channel, and must be sensed using the opposed mode. Diffuse sensing is not possible, due to large differences in reflectivity of frame materials. The thickness of the lead frame material is 0.1 mm and the diameter of the beam is 0.5 mm. The D10 Expert sensor is able to differentiate this low contrast.
Objective:
To sense presence or absence of an IC lead frame
Sensor Models:
Model D10DNFP
Fiber Optic Models:
One pair of model PIF26UMLS individual plastic fiber optics.
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D12 Wafer Cassette Presence Detection in Vacuum
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2003-02-05
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1274
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210 |
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D12 Small Parts Counting
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2003-02-05
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730
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209 |
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D12 Single Fiber Bond Wire Break Detection
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2003-02-05
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839
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208 |
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D12 Robotic Wafer Center Detection
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2003-02-05
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1009
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207 |
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D12 Integrated Circuit Detection
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2003-02-05
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727
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206 |
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D12 Dual Fibers Bond Wire Break Detection
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2003-02-04
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686
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205 |
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D12 Expert Lead Frame Hole Detection
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2003-02-04
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668
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204 |
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D10 Expert and VS2 Stack Height and Adhesive Bead Detection
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2003-02-04
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720
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203 |
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D10 Expert Poly Bag Seal Detection
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2003-02-04
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715
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202 |
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D10 Expert Lead Frame Presence Detection
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2003-02-04
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926
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201 |
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D10 Expert CD Stack Height Verification
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2003-02-04
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1424
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11
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