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Applications
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2003-02-13 |
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VS1 Lead Frame Edge Sensing
In the process of die bonding and wire bonding, lead frames are conveyed in a tall vertical cassette. To increase throughput, the cassettes are inspected to determine if a lead frame is present in each slot.The lead frame can be as thin as 0.1 mm (0.004")and difficult to sense. The VS1 convergent sensor can easily sense this thin profile, as well as non-reflective plastic ball grid arrays (PBGA).
Objective:
To sense the presence of the lead frame in a cassette
Sensor Models:
VS1AN5C10
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VS1 Lead Frame Edge Sensing
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2003-02-13
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1441
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265 |
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VS1 Glass Panel Detection
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2003-02-13
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779
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264 |
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VS1 Conveyor Handling Inspection
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2003-02-13
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794
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263 |
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VS1 Circuit Board Sensing
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2003-02-13
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777
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262 |
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VS1 Bottle Sensing
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2003-02-13
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707
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261 |
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T8 Missing Candy Detection
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2003-02-13
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761
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260 |
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T30U Overhead Crane Guidance
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2003-02-13
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803
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259 |
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T30U Inverted Object Detection
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2003-02-13
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738
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258 |
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T18U Empty Comb Verification
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2003-02-13
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710
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257 |
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T18U Clear Material Detection
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2003-02-13
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713
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256 |
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S18 Box Detection
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2003-02-13
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763
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11
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