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Applications
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2003-02-22 |
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1045875156.bmp
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MINI-ARRAY High Resolution 3D Box Profiling
The three arrays are positioned at right angles to each other. Array controllers transmit box length, width, and height data to the host process controller. The host compiles information for all the parcels and determines a packing program which optimizes use of cargo container space
Objective:
Accurately measure boxes to be shipped.
Sensor Models:
MAHE64A emitters, MAHR64A receivers, MAHCN-1 control modules.
ÀÚ·áÃâó : BANNER
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365 |
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MINI-ARRAY Log Diameter Profiling
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2003-02-22
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2669
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364 |
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MINI-ARRAY High Resolution 3D Box Profiling
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2003-02-22
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2404
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363 |
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LT3 Log Profiling
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2003-02-22
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1703
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362 |
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BEAM-ARRAY Paint Profiling
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2003-02-22
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1617
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361 |
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BEAM-ARRAY Log Diameter
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Àü±âÀüÀÚ, ±â°è, ÈÇÐ
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2003-02-22
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1396
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360 |
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BEAM-ARRAY Box Profiling
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Àü±âÀüÀÚ, ±â°è, ÈÇÐ
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2003-02-22
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1353
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359 |
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BEAM-ARRAY 3D Log Profiling
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Àü±âÀüÀÚ, ±â°è, ÈÇÐ
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2003-02-21
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1578
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358 |
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VTB Assembly Process Verification
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Àü±âÀüÀÚ, ±â°è, ÈÇÐ
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2003-02-21
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1612
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357 |
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SL30 Gear Tooth Sensing
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2003-02-21
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1649
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356 |
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Q45U Ultrasonic Bin Fill-level Detection
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2003-02-21
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1298
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355 |
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Q45U Roll Diameter
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2003-02-21
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1643
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11
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